I have been trying to deposit AlN in a magnetron sputtering chamber with a pure Al target in Ar/N2 environment. After numerous attempts with varying power (RF and DC), N2 percentage, substrate heating and other relevant parameters in the system, the film persists to grow in amorphous phase.
I have changed the substrates as well from Si to Sapphire and glass etc. the results remains the same.
Kindly suggest where there could be a correction needed.
Thanks