I want to maintain SiO2 wafer's OH layer.
So, after oxidation on the quartz wafer surface, i put it in the oven(60 ℃ ) for 12 hours, and then cooling it at room temperature for using it.
But 12 hours activation just be selected by my think.
So i want to know how long can it be stored to maintain oxidation thickness?
please help me..
A silicon oxide surface has a high surface free energy. Usually, it is covered with a layer of adsorbed substances. If you clean the surface (heating to 60°C will not suffice!) you can remove the adsorbates. You can check for that with a drop of water. It is supposed to spread on a clean SiO2 surface (contact angle < 10°).
The layer of water adsorbed from the surrounding atmosphere is formed more or less immediately in normal atmosphere. The adsorption of hydrocarbon usually takes some hour as you see with an increasing contact angle of a water drop on the surface.
If you want to do experiments with a clean SiO2 surface do them as quickly as possible after the cleaning.
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