I am trying to electroplate pure Ni on alumina dispersed strengthend copper substrate. The substrate was processed with a round of acid pickling ( 200 g/L sulfuric acid, 6 mins, room temperature) prior to electrodeposition. The solution for acid picking of copper is recommended in the handbook. However, the adhesion of Ni coating is quite poor. Is there any special notes for the acid pickling of alumina dispersed strengthend copper prior to electroplating? The same pickling can bring about a good adhesion for Ni coating on pure copper or CuCrZr alloy. What is the right solution for pickling of alumina dispersed strengthend copper?
Have you tried a Wood's Ni strike? Basically, NiCl2 in HCl prior to Ni plating? Adhesion to alumina will be a problem, but if Cu is a substantial percentage of the surface area, you may be able to get adhesion to the Cu and bridge the exposed alumina.
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