19 July 2022 1 3K Report

We use Nitric-HF-Acetic mixture - HNA - to etch silicon. HNA is the most popular isotropic etchant. Some part of Si surface do not need to be etched. We try to use masks - various hard baked photoresists, adding adhesion promoters, try parylene too...but the HNA is so agressive that everything flakes off. And we also prefer to avoid silicon nitride mask. What might work better as the mask here?

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