I hope it depends on the pulse width, laser energy, and exposure time.
the damage threshold is typically indipendent from thickness, but it could depend on film morphology! Good luck!
The laser induced damage threshold is in general independent from the sample thickness. It depends on the pulse length, the wavelength of the laser irradiation and a material dependent parameter, which we suggest as the "energy to dissociate the materials molecules into their atomic constituents" See therefore our recent publication: https://www.researchgate.net/publication/260749107_Femtosecond-laser_induced_ablation_of_silicate_glasses_and_the_intrinsic_dissociation_energy
However, if the thickness of the ablated layer is smaller than the optical penetration depth (typically in the range of few hundreds of nanometer) other effects can occur. Additionally, we have to decide pulses of >10ps and
Thanks to all for your valuable information.
Could you please suggest me what is the lower and upper limit of Laser energy is suitable for organic single crystal.
today, I stumpled into a new article showing thickness dependence of laser ablation:
"Influence of Film Thickness on Laser Ablation Threshold of Transparent Conducting Oxide Thin-Films"
Here is the link:
http://www.sciencedirect.com/science/article/pii/S0169433214006229
Did not read it yet
The damage threshold is typically thickness dependent, at least for coherent sources relative to the material thickness. Interference effects in the material change the transmitted and reflected intensities, and the magnitude of the standing-wave electric field in the material. When we test materials, I typically deposit an "absentee" thickness, an integer multiple of a half-wave optical thickness, to avoid changing the %R or %T. An alternative approach for substrate materials is to test in p-polarization at Brewster's angle, to avoid any change in %R/%T. This needs to be accounted in the projected surface area, but the thickness influence is removed.
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