In anodic bonding of silicon wafer and pyrex glass, what is the role of compounds like boric oxide, sodium oxide and aluminium oxide?

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Leonid Sinev

There is no use of other compounds. NaO of borosilicate glass brokes earlier into Na and O than other components broke into their parts. Moving of Na towards cathode leaves oxygen behind. This oxygen reacts with silicon at glass-silicon interface.

Potassium is also moving likewise. More information you can read in "Characterization of Cation Depletion in Pyrex during Electrostatic Bonding" (http://jes.ecsdl.org/content/150/10/G624) and "Chemical analysis of bonded and debonded silicon-glass interfaces" (http://iopscience.iop.org/0960-1317/11/5/401/).

http://jes.ecsdl.org/content/150/10/G624

http://iopscience.iop.org/0960-1317/11/5/401/

Soumendu Sinha

Thank you for your answer and sharing the articles.

Regards,

Soumendu

By the way, you can read about components of glasses for anodic bonding in some patents.

For example http://patents.justia.com/patent/6537938

http://patents.justia.com/patent/6537938