I have the wafers (small pieces ~1/4 of 2") with simple topography of 10 um in height. To make airbridge connections between some pads with spans about 15 um I need to make a kind of planarization steps. After that I plan to spincoat a kind of liftoff layers system (Copolymer/PMMA) to expose it via Ebeam tool and make metallization.

I have PMGI SF9, LOR10B and some traditional CAR-based PRs to form "thick" layers.

What kind of approach or strategy can you suggest for "flooding" all the valleys over the topography? I also can open the windows in the resist on the pad tops to obtain contacts, but this layer should be as thin as possible.

Thank you!

More Rinat Galiev's questions See All
Similar questions and discussions