One option is that you can coat the Cu/hBN by PMMA, and then etch the Cu out.

hBN surface you may o2-plasma treat to increase the binding ability.

Alternatively, you also can etch the Cu without PMMA coating, but this approach requires extremely delicate handling (presumably hBN is a few layer thick), here the film will stay on the surface of the water (Cu-salt solution in water).

One option is that you can coat the Cu/hBN by PMMA, and then etch the Cu out.

hBN surface you may o2-plasma treat to increase the binding ability.

Alternatively, you also can etch the Cu without PMMA coating, but this approach requires extremely delicate handling (presumably hBN is a few layer thick), here the film will stay on the surface of the water (Cu-salt solution in water).

Good equation Dr

It depends on the polymer substrate:

For PMMA you can use the steps as described in SI of: Article Enhancing the adhesion of graphene to polymer substrates by ...

Great explanation there, Dr. Artavazda Kirakosyan.

What about a thermal release tape (TRT) provided by (Sunup High Tech Co). I used it to transfer CVD grown monolayer graphene directly to SiO2/Si substrate.

It is difficult to tape the h-BN from Cu substrate by TRT.