During the fabrication of the microfluidic chamber (check its structure in the file, a 5x2.4mm microfluidic chamber with height of 20 μm), the ceilings of the chamber often collapse when bonding pdms slice to the glass, the already pillar to support the ceiling from collapsing, but wont help out well, is there any other methods i could use to prevent the collapse, with no change to the origin geometric dimension of the chip.