I am planning to pattern some HSQ (hydrogen silsesquioxane) on a SiO2 substrate.

I want to dice the wafer with these structure before etching and removal of HSQ, so that I can try multiple etching recipes for my application.

At our facilities, we typically coat the wafers with photoresist before dicing, to protect the wafer from debris. We then remove the photoresist with acetone.

This would be the first time we need to dice something with HSQ still on it.

Any suggestion on how to do it safely, avoiding debris but without removing the HSQ?