A100nm of Chromium is used as a sacrificial layer which is to be removed in order to have a microcantilever suspended. However, after wet etching of Chromium, immersing in DI water, and drying by nitrogen gas, the microcantilever is stuck to the silicon substrate. As a result, nonuniform structures are obtained. I was wondering if there would be a way to get rid of this adhesion?

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