I have sputtered a layer of Ti on FTO and was hoping to perform anodization on the sample to obtain TiO2 nanotube. However, when semi-transparency is achieved, the TiO2 nanotube peeled along with the FTO, might be due to FTO directly in contact with electrolyte, causing gas liberation that strips away the layer. Hence, there is a need of a TiO2 compact blocking layer to separate FTO and electrolyte, as demonstrated in this article: 10.1016/j.matdes.2017.02.028
Is there any way to convert the already sputtered Ti layer to TiO2 compact blocking layer? Do I just put it in furnace and heat it to 450 oC to convert it to anatase? I was hoping to not waste it. Thank you very much.
I would suggest sputter your Ti target in Ar+O2 gas mixture, or pure Oxygen, and deposit a Titanium oxide layer at some substrate temperature, say around 200 deg C. and then anneal in a furnace at around 350, but not more than 400 because you spoil your glass substrate having FTO.
I also suggest using laser ablation with low power to oxidize the Ti layer (less than 100 W)
Regards,
K. Sreenivas Hi, thank you for the answer. Huh, i thought many works heat treated the TiO2 nanotube on FTO at 450 oC to convert them to anatase? As far as I know FTO should be able to withstand that temperature without suffer from performance degradation? I might be wrong.
Other than that thank you all for the answers, I have consulted my supervisor and had make decision to start fresh by introduce Ar-O2 gas during initial DC sputtering stage to form compact layer rather than converting the existing Ti layer to TiO2 layer.
- Badges
- Science topic
- Similar topics
- Engineering
- Petroleum Engineering
- Gas