I would like to plating Ni/Au on the selected area. Can anyone give me a suggestion?
It is a bit like to make golden finger on PCB board.
Instead with the PCB board, I use polyimide as my substrate with buried Au circuit.
I use TiW as a hard mask and dry etch the polyimide to open the contact pads. Thus obtained the structure as the picture (cross sectional).
The initial thinking is taking the TiW as well a lift-off layer. After plating the Ni and Au, we could remover these unwanted layer together.
However, we found that the gold plated on TiW hard mask and is almost impossible to be removed.
Any suggestion?
Thank you!
Margaret Parker
Mix sodium hypochlorite with muriatic acid, use mask it will liberate chlorine gas.
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