I am trying to deposit a thin film of ferrite on a platinum coated silicon substrate by a dip coating method. But when the substrate is being pulled out of the solution, whole deposited layer drained from the surface of the substrate. So how can I increase the adhesiveness of thin film on a substrate? or the wettability of platinum coated silicon substrate for thin film deposition?
Dear Shamal Shingte; the adhesion and wettability of the coating depend on the withdrawal speed and the geometrics of the coated surface, you have to increase the roughness of the surface and adjust the withdrawal speed of the coated sample. as detailed in the following reference;
http://troian.caltech.edu/papers/Miller_MRS_624_01.pdf
You can see the following links:
1. Article Characterization of Platinum-Based Thin Films Deposited by T...
2. Article Optical properties of spin coated Co 0.6 Zn 0.4 Mn 0.3 Fe 1....
You can try O2 plasma treatment or UV-ozone treatment on platinum coated silicon substrate before dip coating.
Saad Zahraw Sekhi Thank you for the references. In the references given by you, author mentioned that how to increase the adhesion between platinum and silicon substrate. But I have to increase the adhesion of platinum surface to deposit a thin film of my material. Thank in advance.
Thank you very much Ching-Hsien Lin . It will be very kind of you if you suggest me a chemical method to treat the platinum coated silicon substrate for dip coating.
Dear Shamal Shingte ,
Happy new year 2022,
You can activate the surface of platinum by wet etching it using Aqua Regia.
For the detailed processing please reefer to the paper in the link:
https://www.imperial.ac.uk/media/imperial-college/faculty-of-engineering/electrical-and-electronic-engineering/public/optical-and-semiconductor-devices/pubs/kollensperger.pdf
Best wishes
Thank you Abdelhalim abdelnaby Zekry . I was giving treatment of HCl and HNO3 seperately to the platinum substrate. I will try the mixture of it i.e. aqua regia.
Happy New Year to you also!
Dear Shamal Shingte this is a very interesting technical question. I think that the literature reference suggested by Abdelhalim abdelnaby Zekry is a very useful one. Let me, however, add a note of warning. When you look at the protocol for platinum layer patterning you will read the following statement (citation): "The exposed Pt layer was etched for 185 s, with no agitation." At the first glance "185 seconds" sound rather weird. However, I think it is very important to exactly follow this protocol as far as the timing is concerned. Keep in mind that platinum is soluble in aqua regia under formation of hexachloroplatinic acid (cf. the respective Wikipedia entry at https://en.wikipedia.org/wiki/Chloroplatinic_acid). Thus if you dip your platinum surface into aqua regia e.g. for five or ten minutes, chances are that all the platinum will be gone!
Good luck with your experiment and best wishes, Frank Edelmann
Frank T. Edelmann Really thank you for solving my concern. I will take care of it.
Для достижения высокой адгезии пленки платины к кремниевой подложке можно рекомендовать ионно-плазменное батутное текстурирование поверхности подложки. Батутная технология позволяет создать двухмасштабную субмикронную и наноразмерную текстуру поверхности. По нашему опыту такая текстура поверхности создает условия для высокой адгезии.
Thank you Valerii F. Semeniuk but I want to increase the wettability of platinum coated silicon substrate to deposit a thin film of my material. I dont want to increase an adhesion between platinum and silicon layer.
Спасибо, но я хочу увеличить смачиваемость кремниевой подложки с платиновым покрытием, чтобы нанести тонкую пленку моего материала. Я не хочу увеличивать адгезию между слоем платины и кремния.
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