Hi !
I am trying to deposit a thin layer of Ni-doped ZnO on a copper substrate using SILAR method, however, each time the layer falls off after calcination. Any advice for better adhesion would be much appreciated.
My answer is not going to solve your problem directly but may give a basic idea.
The adhesion between a metal substrate and a foreign oxide will be limited due to energetic conditions and mismatch between physical properties. That is why Ti, Al or Cr thin film (that has a higher affinity for oxygen) is provided between a metal substrate and an oxide layer. The intermediate higher oxygen affinity metal layer gives a better M-M bonding to the substrate and M-O bonding for oxide layer.
You can try oxidizing the surface of copper substrate before ZnO coating, if that is allowable. I am sure that you are taking good care of the substrate cleaning process.
If the problem occurs during the calcination, then you can try very slow heating and cooling rates of calcination. Faster heating or cooling rate could lead to large thermal stresses and the layer could peel off.
If copper substrate is chosen for better conductivity - not for any other reason, can you change the substrate to brass (Cu-Zn alloy, that has ~40% Zn in it, but corrosion may be a problem) or Ti that has better adhesion for oxides?
Hi
Go for silane surface activation.... In this your the adhesion will improve squarely.
Best
Arunprakash Vincent
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