Good question

You can use PLD and controlling the ablation time, distance, temperature you can vary the thickness of the film, you can have a look over this paper and in this website you will get some other publications,

http://web.khu.ac.kr/~mdpld/publications/85.pdf

http://web.khu.ac.kr/~mdpld/facilities_4.htm

Dear prof. Meng Hu,

spattering preferred for this purpose.

Best regards

Lots of thanks to all of you for your answering! I am wondering there is a facile, chemical method for this work.

Best,

Meng Hu

I think ultrathin film formation can be perform by following techniques:

· Metal deposition techniques, such as vacuum evaporation and sputtering, have been well established and are cost effective. The dry process also eliminates the risk of contamination.

· Simple multi-layer deposition, for which each layer is passivated. This method is highly effective in suppressing the ripening effect

10 nm is the critical thickness for whatever deposition method you choose: deposition time does become so short that a consistent, repeatable deposition can hardly be guaranteed.

With very, very scrupulous control of all deposition parameters you might be able to achieve 5 nm uniform, repeatable thickness, But emphasis is on "might".

Thank you very much for these answers. Could I try a technology of spin-coating?

Happy new year to you all!

Spin coating? I don't think so as I expect spin-coated layers to be way thicker.

I might not have been clear enough: I was basically talking about PVD (sputtering); other kinds if PVD or CVD might result in comparable thicknesses.

But spin-coating ???

Thank U. Dreher for the suggestion!

Best,