I have coated P3HT:PCBM thin film on ITO glass substrates. I need a standard procedure to form gold contacts on the surface of thin film. The substrate will be used for testing as an organic photovoltaic.
Kindly explain your question in more detail. What exactly you want to know. or the exact problem.
Depositing Gold electrodes by the thermal evaporator is the most used method. Gold is deposited at a very low current. You can use a metal mask to deposit on a specific area. I Used to prepare my own thick paper or foil mask to cover the film
The evaporation rate at beginning has better to be slow to avoid the penetrate into the P3HT:PCBM layer. The rate can be as slow as 0.1 to 1 angstrom. After 10nm to 20nm with such rate, you could evaporate relatively higher rate, i.e. 5 to 10 angstrom. Prior to your gold coating on the layer, ideally you should give a few nano meter evaporation under the shutter if you just load your gold materials from non-inert environment to get rid of some contaminants.
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