hello everyone, in my recent project i want to deposit tungsten by thin film of ruthenium by PVD method, as increasing temperature to melt ruthenium, part of it evaporate and deposit and another part dissolve in molybdenum crucible, increasing temperature cause crucible breaks and deposited film very thin and not useful.
anybody has experiment or answer about it?
how to deposit Ruthenium by PVD method?
PVD is a whole group of methods, what kind of method are you using?
It almost sounds like you are trying to perform a direct evaporation. If that's the case, it's surprising you got a film at all since the boiling point of Ru is higher than the melting point of Mo. I don't think direct evaporation is a good idea here, maybe sputtering or e-beam-evaporation are better ideas. Du you have any options available?
Dear Ahmadreza Shafieyan many thanks for your interesting technical question. In this context please have a look at the following potentially useful research articles:
Characterization of ruthenium ALD and PVD thin films for in-situ process control by spectroscopic ellipsometry
Conference Paper Characterization of ruthenium ALD and PVD thin films for in-...
This paper cis freely available as public full text on RG.
I also agree with Jürgen Weippert in that sputtering would be a good technique to deposit Ru films. This is described in the following relevant articles:
Effect of sputtering power on the growth of Ru films deposited by magnetron sputtering
Conference Paper Effect of sputtering power on the growth of Ru films deposit...
In addition I suggest to you that you should use the "Search" function of RG to find and access other helpful articles on this topic. As shown below you could e.g. search for the term "ruthenium thin films" and click on "Publications". This will provide you with a list of relevant articles which have been posted on RG (including some public full texts):
https://www.researchgate.net/search.Search.html?type=publication&query=ruthenium%20thin%20films
Good luck with your research! 👍
I recommend sputtering. Use a DC-pulsed generator with low duty cycle in order to keep low the target temperature. Alternatively RF generator. Use low power.
Provide good cooling water circuit on the reverse side of the target and good thermal conductivity. In the past I used thin foils of Rutenium glued on the copper backing plate in order to improve cooling and also reduce costs since Ru is quite costly ...
Best regards,
Simone
Hi. I think the following article could help you:
https://patents.google.com/patent/US20060177601
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