I'm doing Ni-PTFE electroless plating now, however, small amount of PTFE can deposit with Ni layer.
1. If using some dispered PTFE from some companies (Dupont, Aldrich etc.), I'm adding cationic surfactant + nonionic surfactant, but small amount PTFE can be deposit with Ni layer. Problem is that I can't control non-ionic surfactant+stability which former company used. Also, it is difficult to archive high amount of PTFE. Some publications or patents obtained very nice results by only mixing dispersion PTFE with cationic surfactant (Ex. CTAB/FC-4?)?
2. If using PTFE powder (4 micromet size), first I have to make it emulsion by mixing with cationic surfactant + nonionic surfactant, but PTFE particles only can dispersion into solution being precipitate and no PTFE deposit with Ni layer. I think the size of particles are big, which can not deposit with Ni layer. Can anyone help me how to make the PTFE particle size being smaller during/after dispersion? Should I dispersion PTFE at very high speed of mixing machine?
Hi. I use available from some company ready EN-PTFE kits. For example PTFE Electroless Nickel Plating Kit from Caswell Europe. PTFE partcles there definitely submicron ones - and I believe that is the key, 4 um is too much.. Layer is quite thick for my application. Take a look on http://www.caswelleurope.co.uk/ptfe-electroless-nickel-plating-kit-coating-for-low-friction-parts/
Thank you very much, Sir. I know some commercial dispersed solutions are working well. I'm trying with my owner dispersion, but is does not working.
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