No ionization integrals possible at this bias point. Possibly applied voltage is less than DELTAV in field line calculation or the electrode does not contact any semiconductor material.
welcome! In order to answer your question one has to view your structure and its biasing. If your applied voltage is less than the breakdown voltage, the ionization integrals will be zero. So, f you want to simulate the device for breakdown you have to bias it near the breakdown. The other warning message concerns the contact of he metal electrode to the semiconductor layers.
My advice is to simulate first the device and nominal operating conditions and then at the extreme ones.
Thanks for responding to my question Dr. Abdelhalim Zekry. I would like to share my structure here sir. Please let me know the mistakes that I am doing :
#InGaN p-n junction
go atlas
# MESH SPECIFICATION PART
MESH AUTO
#x-dimension
x.mesh loc=0.0 spac=0.01
x.mesh loc=1.0 spac=0.01
#y-dimension. Defining 50nm top and bottom thicknesses for electrodes. 0 nm to 400 nm is the InGaN material.
y.mesh loc=-0.050 spac=0.004
y.mesh loc=0.0 spac=0.004
y.mesh loc=0.160 spac=0.002
y.mesh loc=0.240 spac=0.002
y.mesh loc=0.400 spac=0.004
y.mesh loc=0.450 spac=0.004
#DEFINING REGION
REGION num=1 MATERIAL=InGaN x.min=0.0 x.max=1.0 y.min=0 y.max=0.200 x.COMP=0.08
REGION num=2 MATERIAL=InGaN x.min=0.0 x.max=1.0 y.min=0.200 y.max=0.400 x.COMP=0.08