Do you treat the just TiO2 blocking layer, or both bl-TiO2 and mp-TiO2 when fabricating FTO/bl-TiO2/mp-TiO2/HTM/Au device? I did deposit bl-TiO2, dry at 125 degree C for 5 mins, spincoat meso-TiO2 then annealed at 500 degree C for 30 mins. After that, this FTO/bl-TiO2/mp-TiO2 is soaked to 0.04M TiCl4 solutions in DI water with heating in oven at 70 degree for 30 mins. The thing is, I read other paper, they just treat the bl-TiO2 layer while some of them treat after they deposit the meso-TiO2. Is that make any different (in term of improving contact/device performance etc)?
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