For some special reason, I hope to reduce the adhesion between AZ-5214E photoresist and silicon wafer. Right now I spin coat AZ-5214E on solvents & DI water rinsed smooth silicon wafer, without the usage of any primer. The adhesion of photoresist is still too good. May I ask if anyone know how to further weaken the adhesion of photoresist?
Dear Zhaohui Li,
It's a bit unusual question. Usually, everyone is looking for a good adhesion. Here below is a wide info on a photoresist adhesion measures. That may prompt you to think about how to do the opposite.
What affects photoresist adhesion?
This peel formation is mainly caused by three factors: low adhesion energy of the photoresist to metal, strain energy of the photoresist generated from the nitrogen gas and transfer of irradiation energy by UV light to the photoresist film.
www.diva-portal.org/smash/get/diva2:17611/FULLTEXT01.pdf
www.sciencedirect.com/topics/engineering/photoresist
https://www.allresist.com/resist-wiki-what-are-the-adhesion-features-of-photoresists-on-different-wafers/
Dear Zhaohui Li,
As rightly said by Dear Len Leonid Mizrah , people usually look for good adhesion or try to improve it further using primers and adhesion promoters because PR has poor adhesion with some surfaces. Metals are the ones that usually provide poor adhesion substrates. Since you haven't disclosed your application, its hard to predict what you want to achieve.
You can make the surface of Silicon smoother by polishing, Deposit/Sputter metal on Si and/or use some other thinner resist.
Regards.
Zhaohui Li as mentioned by Len Leonid Mizrah and Raja Fazan Gul adhesion is typically the main goal. However, I've had poor adhesion before due to the kind of resist I used. If you can use different PR you may find one that has lower adhesion. However this may cause issues during development as you may get pattern lifting.
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