I have a micron sized layer of TiO2 and I want to deposit 50 nm of Nickel. The diffusion of Nickel into TiO2 is creating a problem for me. How do I prevent this diffusion? Any barrier layer? If so, what material? I use Physical vapor deposition method to fabricate these layers.
Dear Sarkar
If carbon is suitable for you application, you can deposit a sandwich layer of carbon between TiO2 and Ni. Otherwise, you have to control the deposition temperature because diffusion of solids depends on the temperature.
Regards,
Hi Sumant, a barrier layer is the most commonly used method to stop this type of problem. The actual material to use will depend a little on what you can get away with, without ruining what you actually want to make! If you can use a metal, I have heard that chromium is very good, for an insulator, you might get away with something like tantalum oxide. But avoid the noble metals at all costs!
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