Every time i have faced a problem of short condition when i made a thin film based PIN solar cell using spin coating using ZnO and CuO as n type and p type materials and silicon nano particle which is extracted from the sand of Padma river using Aluminothermic Reaction.How can i Recover this problem,please help me if possible.
Thank you for your kind response. Sure,my problem is when i want to fabricate a PIN solar cell using spin coating method as Ag (paste)/p-type CuO(20 layer)/intrinsic Si(15 layer)/ n type ZnO (7 layer)/FTO, each layer with 20 mL solution of required material & methanol is used as solvent for both ZnO and CuO at 3000 rpm) a problem irritates me every times when i put contact with silver paste it reaches to FTO and be shorted.How can i recover this short connection between silver paste and FTO?
So you used FTO as transparent conducting oxide and then deposite ZnO/ intrisic Si films/CuO films/ Ag, right?
you used Ag paste for metal electrode. I think if you use Ag paste on top of your ZnO/Si/CuO films will damage on it. Can you use evapoation method for deposit Ag?
Thank you so much for your quick response.
Yeah,you are right,i used such.Due to technical problem,i can't use evaporation method currently in my Laboratory for depositing Ag.Since only spin coating method available,Have any advice to recover my problem for the case of Spin coating method?
Yes, no problem.
Have you check carefully when you coated Ag paste on the film? I guess your Ag paste may broke your films and touch to FTO side.
If you can't see any problem after coating Ag paste, I recommend you to check by SEM of your films both surface and cross-section images.
Hope it will solve your problem.
good luck
Thank you for your kind Advice.Also i am so happy to get your response quickly.
You can use any one layers of Au, Ag on the top of p-CuO layer by evaporation method. After that you can use Ag paste on top of Au, Ag layer in stead of only Ag paste only on the p-CuO layer. I am double about the thickness of CuO. How much thick of CuO? I am thinking thant the thikness of CuO layer is exremely thin and that is why Ag paste make short circuited. You can try another way to ovecome the shor circuited problem by making CuO more thik. After doing that if you not success please you will check surface morphology and the cross-section. If you find that there are are few crack in the CuO layer then try to make smooth film without any crack. I hope you will success after trying these steps.
Thank you Sir for your advice.Due to tecnical problem in our Laboratory the thickness can't estimated exactly but i used 3 times CuO layer compare with ZnO using each layer 10 micro letter solution during spin coating.I spin coated 5-10 layers of ZnO of FTO then 15-25 layer of CuO but every time same problem i faced.I will inform you sir as soon as possible after trying according your advice.
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