Hi Chowdury Kabir, it could be quite complicated as the fibrous nature of the substrate will mean that the layers will tend to cling to the fibers, and even penetrate between the coarser ones. So not forming a uniform flat surface, which would make the usual mechanical film thickness measurements very difficult best. For the palladium thickness, in future you could place another substrate material (glass etc.) close to your sample, and then determine the thickness deposited onto that which can be done with an AFM or Dektak. You may be able to use SEM (microscopy) and Ion Beam milling to "etch" a small area of the fibre and see the thickness of the layers, though it would be rather complex. Otherwise the only other real option I can foresee is to sacrifice a small section of the material and attempt some analytical chemistry to determine the quantities of the different materials present.

Dear Altruist,

Thanks to give me your fruitful suggestion. Before, I used the silicon wafer substrate to measure the palladium deposition thickness by FE-SEM. My estimated thickness should not over 40 nm which is known already. I concerned how to cut the sample without mechanical stress. As I it is known already, thanks you so much to give your effort for me.

This article helps you