First of all, you can measure hardness and Young`s modulus of thin films, if you do evrything right. But there are a couple of things to keep in mind, if you want good results.
Further on, you can use the nanoindentation tool to investigate more properties of thin films such as fracture toughness, adhesion to the substrate, wear properties and so on, but this things are not so easy accessible.
If you want detailed information about the deformation behaviour of your material, I think you have to combine nanoindentation with other experimental methodes.
(f.e. see: In-situ Observation of Cross- Sectional Microstructural Changes and Stress Distributions in Fracturing TiN Thin Film during Nanoindentation)
Thanks for your reply, I would like to ask, as you mentioned, fracture toughness is basically a single property (crack length vs load or kc vs load), what about the adhesion to substrate, how we can check the adhesion to substrate, is there any standard method to do that. What other methods would you suggest in combination with nano-indentation.
I went through the paper, the methodology they mentioned is in-sutu with X-ray diffraction, which is specially designed for the case. Normally, XRD, and nano-indentation are not coupled together.
You can get the Hardness, Modulus, Plasticity Index and Creep Data from the Nanoindentation. Coupling Nano/Micro Scratch can give you some insights into the fracture toughness and adhesion strength.