I am trying to dice a 4" wafer made from Gorilla glass ( McMaster Carr 8410T3) using a Disco DAD3220 wafer dicing machine. I am having trouble getting a clean cut.
When I set the blade to cut the entire thickness of the wafer, the wafer cracks.
When I try to cut only part way throughput the wafer, the cutting is executed well but when I try to tap the wafer along the scored edge, it shatters.
Do you have any suggestions on how to work around these issues or experience with dicing Gorilla glass and could share your experiences?
With delicate wafers, (after pre-scribing), I've superglued them to a balloon and then delicately inflated aforesaid balloon. The balloon holds the pieces together. Not sure if this trick would work for your allpication.
It may be helpful to contact your Gorilla glass supplier and ask them for their input on your issue.
Regards,
LH.
I tried to cut gorilla glass on the Disco DAD saw. Glass was cracking, producig a net of cracks.
I think that Gorilla glass may be impossible to cut. According to Wiki
"During its manufacture, the glass is toughened by ion exchange. The material is immersed in a molten alkaline potassium salt at a temperature of approximately 400 °C wherein smaller sodium ions in the glass are replaced by larger potassium ions from the salt bath. The larger ions occupy more volume and thereby create a surface layer of high residual compressive stress, giving the glass surface increased strength"
My understanding is that when you cut gorilla glass you release the stress introduced by the process. I think that this whole process is designed to precut the glass and then dip it in the molten salt.
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