Some articles reported their FTIR result with a film with 100-300nm, while one of our postdoc asks a film more than 700nm for FTIR measurement. What is the thickness requirement for FTIR measurement?
It all depends on the FTIR technique used. You can easily see IR fingerprint of monolayers from 1 nm (3-aminopropyl silane) to monolayers of stearic acid (2.0-2.5 nm) depending on packing and therefore tilt angle.
You can do ATR-FTIR, use a single bounce reflectance or diffuse reflectance accessory or IRRAS.
What is film made of and what you want to deposited on?
It may be a confusion between the actual film thickness and IR penetration depth that is about 0.7 microns or 700 nm. Can be 0.5 - 2 microns depending on substrate. This is commonly used and known in ATR-FTIR.
dp= depth of penetration of the IR beam into the sample, defined as the distance required for the electric field amplitude to fall to e^-1 of its value at the surface;
λ= wavelength of light
θ = the angle of incidence of the IR beam relative to a perpendicular from the surface of the crystal.
Look for additional details in the literature on ATR-FTIR
For sample acquisition use the modified silicon wafer.
When you get the spectrum, check for the C-H sym and asym stretching bands betwee 2800-3000 wavenumbers (no need to worry about the bending modes or C-C bands in the fingerprint region).
Also you should obtain the Si-O bands also very intense.
If you see the C-H stretching, is sufficient to know that your wafer is modified.
If you want to measure film thickness, I suggest ellipsometry or AFM.
I believe ATR would work for your 200 nm film. ATR has been used to study the surface chemistry during atomic layer deposition process which require a detection in the Angstrom level.
I suggest to try in transmittance mode because I think that wafer silicon are transparent in middle IR . First the background with silicon wafer and then the silicon wafer +the coating .