I am trying to deposit Cobalt film (> 100 nm) on Si/SiO2 wafer first (by sputter), do some treatment on the thick film, and etch back the Co film down to sub 10-nm thickness.
Maintaining the initial smooth surface is much important than a precise thickness controlling.
Is there any recommendable method to get a smooth and thin (sub-10 nm) Co film by etch back?
I wonder wet etching will be able to preserve the original smoothness.
(If possible, which kind of etchant is effective to Co?)
Thank you.
Please take a look at this page http://www.cleanroom.byu.edu/wet_etch.phtml which might help with wet etchants. A couple of considerations: watch for undercutting with wet etching, also, etchant temperature could impact on your etching rate. It might also be worth considering plasma etching.
http://www.cleanroom.byu.edu/wet_etch.phtml
- Badges
- Science topic
- Similar topics
- Physical Sciences
- Materials Science
- Thin Films and Nanotechnology