The SU-8 photoresist is based on an epoxy resin developed by IBM. If the duration of release of the structure will be long, which will eventually lead to degradation of the SU-8 structure due to prolonged exposure to chemicals and higher production cost. Could you read the information for different types of SU8 data sheets regarding the references of processing conditions in the website of http://www.microchem.com
I have found that SU-8 is typically very robust; especially if you perform a true hard bake at the end of processing. This is one reason SU-8 has been so popular.
However, if you start working with much thinner films (I have successfully achieved reproducible 50 nm thick films by dilution with cyclopentane) you will find that you may start to encounter problems with harsh chemicals or environments.
Can you give any more dteilas on the film thickness and the end application of your structure?
However, I have not experience with time longer than a few years. It probably depends also on what you mean degrades (e. g. some aggressive chemicals cause the SU8 to crack, but none seem to dissolve it). In my experience, too, some features may depend on the type of SU8 used.