I am conducting some High Cycle Fatigue experiments on notched and unnotched bulk solder specimens under different mean stresses. Using the local stress approach I am trying to validate(FEA) the approach with the components directly under vibration environment. Even thought its a traditional approach for mechanical structures, welded joints and so on, why this hasnt been carried on to the electronic industries ?
Hello Aria Tsam
Thanks for the response.
But my question is so specific here.
I am very much aware of the fact of how to perform a fatigue analysis on a solder joint .
The first publications is based on a component BGA and the second article is again on a empirical level for thermal cyclilng using FEA or not.
But the problem with deriving the fatigue equation out of the electronic component is not a better method to learn the behavior of a solder joint as, for example a group of materials and mechanical assembly is contributing to the stress strain field in the solder joint.(In BGA: the overmould, the chip the type of PCB and so on)
If someone know or worked with regarding performing the fatigue analysis on solder material and understanding the local fatigue behavior of the solder alloy either in high cycle or low cycle fatigue let me know.
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