I'm trying to understand some XRD and EBSD images I obtained for Pt films that were deposited and annealed under different conditions.

In the attached image, there are four sets of XRD/EBSD measurements corresponding to Pt films sputtered at different sputter pressures/oxygen fractions. The XRD images show the texture both before and after annealing the films at a high temperature. The EBSD orientation imaging maps (OIM) for the POST-ANNEAL films are shown as the insets. These are colored according to the orientations of the grains, with the mapping shown on the right. As can be seen, the sputter conditions and subsequent anneal have a large effect on film texture.

For the XRD images, the main peaks observed are [111], [200], [220]. I'm guessing this is because Pt has FCC structure, so other planes like [100], [110], correspond to forbidden reflections and are thus not recorded. My question is how exactly this relates to the EBSD images. Does the [200] peak in the XRD image basically arise from the grains that are colored red according to the [001] orientation in the EBSD map, and the [220] peak from the grains colored green according to the [011] orientation? I don't have a very clear understanding of XRD or EBSD so some clarification on how all this works would be much appreciated!

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