What means L layer?
Which problem do you spect by the use of TMAH?
I suppose that you use a silicon wafer and TMAH to produce a cavity for the pressure sensor, but I think we need more information about the process to try to help you.
Anyway, you have to be very careful with the toxicity for humans of the TMAH.
Dear Jose,
Layer L is a typo error.
My brief process floe is like this,
1. Silicon wafer 100 orientation
2. SiO2 development on the device layer
3. TMAH etching from back side
4. Then development of Polysilicon on top os SiO2 using CVD
so my question is once I perform TMAH, can I take my device to CVD chamber, is that allowed. Please tell me if their any other alternate way to deposit Polysilicon after TMAH process. (provided DRIE/RIE is not an option as those machines are not available)
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