I am fabricating a thin film transistor using high-k dielectric material. I need easy steps to coat a thin film on the substrate.
It depends on what variables you need to control in this process.
1) Is the film thickness of importance ?
2) Is the material a conductor, semi-conductor or insulator ?
3) Is the material or substrate susceptible to temperature variations (i.e. low melting point) ?
4) Is film flatness an issue ?
If you can answer these I can probably suggest a suitable method to do this.
The easiest way to make a uniform thin film on a surface is by spin coating (if you can make a solution or a dispersion of the material you want to use).
I am agree with the suggestions made by Christopher Quinn. The coating of a material also depends upon the various factors such as:
1. Whether you want pure film i.e., do you need vacuum for that?
2. What type of material do you want to coat?
and many other parameters...................
Spin coating is a chemical method. One needs to know what kind of film it is and if it is possible to prerare it.
Can you prepare a solid target of the film material?'
then you may use sputtering, pld, e-beam evaporation too
I totally agree and respect all your comments. However, I have involved mostly on CVD process to develop thin films of metal, metal oxide, carbide as well. I suggest that CVD is the better method to grow thin films of any materials. If you need any discussion on CVD and related issue please feel free to contact me ([email protected]).
CVD is an excellent process for producing thin films for certain applications, especially high volume production and high rate of deposition; but for bespoke and highly controlled deposition (especially over thickness and composition), PVD is a superior process.
I totally agree with Christopher and Michael. You need to provide us with further details. And i guess that PVD (sputtering, PLD etc.) is more suitable process. We are waiting for your feedback Cyril...
all the comments here are very true.... but most simplest methods are dip technique as well dr.blade method... for the substance like TiO2 this dr.blade method really working out great... but depends on use for wat we need really..
To my opinion, a growth method should also guarantee that you obtain the same samples if you follow the same procedure. Simple does not mean necessarily efficient. The question is how good you can control the growth parameters.
Welcome to all comments but better to first discuss which parameter you want to control such as thickness, roughness etc.
thin film deposition methods have own drawbacks so before knowing the materials availability type and applications, for which u r going to deposit thin films, difficult to say about one method .
Thnaks for all ur reply... I m using a dielectric substance, whose dielectric value is high (probably Hafnia or Zirconia or silicates of Hf or Zr). But I m using a flexible polymer substrate..... So, which process will be best to coat a thin film on the substrate.. Want to reduce thickess as much as possible... (no need for a compulsory nano thickness)
In my opinion the best and more controllable technique is Pulsed Laser Deposition (PLD). Sputtering will deform your substrate, due to localized high temperature of the species.
Gregory is correct if your target to substrate distance is small (
If you want to use polymer high-k dielectric material,spin coating is the best choice.
For inorganic high-k dielectric material,sputtering and CVD are normally used.
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