I’m planning to investigate thermal stability application for rubber articles. I really want to find out what you’d consider to be the most efficient practical methods as cost and time.
If you have DSC you can do Oxidation Induction test (OIT) at isothermal conditions (based on temp. of your interest). Its a common test used by wire & cable folks to test thermal stability of x-linked polyolefin cables.
Well! OIT, TGA/DTA and DMA (loss factor Vs temperature) are the the three most common tools used by polymer and rubber guys to study thermal stability. So, what's the issue in your case? Why you can't use all or any one of the tools?