I am trying to coat wood using SF6/Argon cold-plasma with low-pressure (0.3 torr). My aim is to increase wood hydrophobicity. However, I always obtaining a hydrophilic surface. I used higher SF6 flow rates (50 sccm) and lower argon flow rates (5 sccm); different discharge times (5-10 min) and power levels (50-100W) but surface samples became fully wetted.
Anyone have expertise in this topic?
Kind regards,
Pedro
Dear Pedro,
you can see the chapter 16 in handbook of wood chemistry and wood composites edited by Roger M. Rowell.
see the blow link:
https://www.crcpress.com/Handbook-of-Wood-Chemistry-and-Wood-Composites-Second-Edition/Rowell/9781439853801
Ehsan
SF6 will certainly form F-radicals reacting with the hydrogen of the organic material to HF. Bonding to C-atoms of the wood obviously does not happen. Mostly CxFyHz (were z also can be zero) gases are used to create hydrophobic saturated CF surface groups. I a certan CxFyHz material is still working as a plasma etching reagent, adding hydrogen to the plasma can help to shift the equilibrium to CFx deposition.
Thanks Mr. Bari
Dear D. Theirich, Can I impregnate wood with any solvent containing great quantity of hydrogen instead to add hydrogen gas in the reactor? Is a good idea Increasing number of hydrogen molecules in wood structure to react with SF6?
I think that use some numerical model to get some optimal parameters before performing an experiment if possible.
Comsol might help you to save time and resources.
Can plasma density / electrode diameter influencing the hydrophobization of wood by SF6 plasma? I am using an electrode with 30 cm diameter.
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