I was doing lift-off to generate metal patterns on top of glass substrates. I used LOR1A/5A (tried this two different lift-off resist) as the lift-off resist layer, then spin coated another layer of shipley S1813 as the pattern layer.
The process flow is as follows:
After the development, it seemed the whole PR layer was peeled off if the development time was more than 45s, say 1min. The PR was too sensitive to the developer, which shouldn't be the case.
Has anyone also had this problem before? Could you please give some suggestions? Thanks!