01 January 1970 6 4K Report

I was doing lift-off to generate metal patterns on top of glass substrates. I used LOR1A/5A (tried this two different lift-off resist) as the lift-off resist layer, then spin coated another layer of shipley S1813 as the pattern layer. 

The process flow is as follows:

  • Clean glass slides
  • Bake glass slides for 5min @200C
  • Spin coat LOR5A for 5sec @900rpm, 60sec @4000rpm
  • Pre-bake for 5min @180C
  • Spin coat Shipley S1813 for Pre-bake for 2min @115C
  • Exposure for 7s
  • Development with MF319 (0.24N) for 45s
  • Rinse with DI water and blow dry
  • After the development, it seemed the whole PR layer was peeled off if the development time was more than 45s, say 1min. The PR was too sensitive to the developer, which shouldn't be the case. 

    Has anyone also had this problem before? Could you please give some suggestions? Thanks!

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