We are trying to sputter a metallic target. We can clearly see the plasma however after depositing for more than 30 minutes there is no deposition on the substrate. What can be the reason for this? need expert advice.
Thanks!
When you look into your chamber, do you see anything happening at all?
If something else gets coated, but not your substrate, there may be a short circuit in the chamber which directs the material to a wrong place.
Also, if you have log files, check the reflection values. If you have e.g. an MF-ICP source with additional RF, it might be that the MF ignites the plasma, but the RF isn't actually arriving inside.
As you are saying its metallic target...is the power constant or you see continuous adjustments needed....is manipulation needed then there may be poisoning of target and there want be any deposition on substrate. Second , what kind of substrate is kept?? If there is a possibility of charge accumulation there then make proper contact through silver paste....optimise pressure and gas flow....
You have low density plasma (the plasma power is too low) or the distance from the substrate to the target is too high. As my colleagues Jürgen Weippert and Jignesh G. Hirpara were saying look for plasma reflection back to the magnetron or verify if the substrate does not charge itself electrically.
I think that the gas pressure is a critical factor. Increasing the gas pressure will raise the collision frequency and the sputtering rate, but it will reduce the average mean free path of the sputtered atoms to reach the substrate and will also reduce the adhesion.
So, it is better to control the gas pressure in low range to have better adhesion and allow a longer mean free path of the sputtered atoms reaching the substrate.
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