Though Gold, Palladium and nickel have same workfunction, gold and not palladium nor nickel used as metal elcetrodes for bottom contact bottom gate OTFT?
Does thiol treatment has any effect on Palladium or nickel electrodes as in gold?
Can you suggest some paper/article relating to this??
I have no paper, but some experience to share:
- Ni is no noble metal, thus it might be affected by the process chemistry.
- Pd is a noble metal, but it's chemical properties are more like those of silver. It is to some extend vulnerable vs. hydrochloric acid.
- I can imagine that another property counts: Ni and Pd are well-known for their diffusion barrier properties while gold allows diffusion - happily integrating 'foreign' atoms into its lattice. In the classical semiconductor manufacturing, the so-called Kirkendall effect is infamous - gold 'eating up' an Al metallization.
If you want to know more about material properties: why not start using the 'magic tool' called wikipedia? en.wikipedia.org
Hope this helps
The answer is quite simple. Researchers have done already some experiments with palladium and the results were not so good (e.g. Necliudov et al, Solid-State Electronics 47, 259 (2003)) and nickel was really terrible (e.g. Nichols et al, Applied Physics Letters 83, 2366 (2003)).
Although people are not fully sure with the reason, probably it is because of the surface oxides.
Of course, thiols always influence the effective work-function of the metal electrode, since the interfacial dipole is created. On the other hand, although it is very common approach, the detail discussion is not possible to carry out since the dipole moment of the molecule cannot be estimated properly before the covalent bond (with metal surface) is created.
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