Adding copper acetate with KI in polyamide during polymerization, there is always some copper plating out and deposits on the surface of the polymerization device. There is a reduction reaction Cu2+ to copper metal during the polymerization. How does this reaction happen? What is the reaction equation?
Copper plating out in polyamide during polymerization occurs due to the reduction of Cu²⁺ ions to metallic copper (Cu⁰), represented by the reaction: Cu2+ + 2e- ---------Cu.
This reduction can be influenced by factors such as pH, temperature, and the presence of reducing agents.
Yes, Cu²⁺ can theoretically react with free radicals to form metallic copper by accepting electrons, but this isn't the main mechanism. Free radicals are more likely to indirectly contribute to copper plating by creating other reducing agents in the polymerization mixture.
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