I have available an equipment PVD for sputtering/evaporation (Intercovamex TE12), can I use wires, pellets or powder for sputtering or evaporation? Or how should be the material physical presentation?
Usually, 2 inch steady solid target. Many companies sell it.
You have to buy the target (usually 2", 4" or 6" of dia) of the material you have to sputtered.
Either you can buy or make 2" dia solid targets. The diameter of your target depends on the sputtering gun you have. If you have some smaller dia pallets then you shoud go for some couplers to use those targets in conventional 2" dia sputtering chambers. Moreover, you can sputter metals, semiconductors and insulators but in case of semiconductors and insulators you have to use RF power source rather than DC source. I think It will help you.
The material should be in the form of a solid or composite circular disk target with the diameter of the insert as a function of the intended composition for co-sputtering. For the powder, it is necessary to compact and thus obtain a sintered target.
If you are considering higher deposition rates then a water cooled magnetron should be considered.
If you are aiming to grow thicker metal films, 1-2microns, then a combination of RF with a DC bias can be used to reduce surface roughness.
Best regards,
Martin
For sputtering, you have to buy a circular target (pressed and sintered powder or metallurgical) with diameter depends on your instrument. Our sputtering target has diameter 10 am and some others has 2 cm. It may be metal or semiconductors. If it is metal, you have to use DC power source. While if it is semiconductor, you should use RF power source. And sometimes, you can use a combination of both power sources.
For evaporation, the sample might be powder or small species of solid materials/wires (mm). However, for sputtering the target should be disc like shape, as it will placed on a disc-like electrode.
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