Can anybody help me to understand the relationship between thermal conductivity and thermal expansion of materials, especially polymer- ceramic composite? Can a highly thermal conductive material reduce the thermal expansion of polymers?
In fact I do not see any reason to look for a correlation between the thermal expansion coefficient and the heat conductvity. The first is related to the non-quadratic nature of the potential function, the second is related to the presence of mobile electrons and/or phonons. Generally "hard" materials exhibit lowet CET and higher heat conductivity, but not necessarily: hard amorphous solids may exhibit lower heat conductivty. "Soft" polymers usually exhibit lower heat conducvitiy and higher CET. Theoretical formulae used to predict composite CET are very much different form the mixture formulae used to predict the heat conducvitiy of the same composites. Therefore, I'm afraid that the tow properties should be optimized independently. Addition of a ceramic surely reduced the CET and increases the heat conducvity, but I do not expect a close correlation.
thank you very much for showing interest to give answer to my question. I am convinced with the points you discussed. Usually polymers suffer from high thermal expansion during high temperature or heat generating operation (like high friction conditions) which limits their application in such conditions .So my intention is whether we can reduce the thermal expansion of polymers by incorporating highly thermal conductive fillers.