What is the most suitable surfactant to control the porosity/particle size of silica below the isoelectric point (pH between -0.5 and 2) and temperature between 50 and 90 C?

We are studying a method to produce nano-silica, where the silica monomers Si(OH)4 are released into the medium (3M sulfuric acid at the beginning and at the end of the process 0.2M sulfuric acid) at temperatures between 50 and 90 C.

Thanks

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