I was trying to deposit silicon (melting point 1414o C ) thin film using electron beam evaporator. When the silicon source inside the crucible started illuminating, within a very small interval of time the crucible was torn into pieces and I had to stop the deposition. Is there any precautionary step associated with the deposition of electron beam evaporation of silicon which I have missed? Thanks in advance.
Hello Bijit,
were you scanning the electron beam when attempting the evaporation? E-beam evaporators usually employ a scanning module that sweeps the e-beam position in X and Y over the target to distribute the heat more or less uniformly and prevent excessive thermal stress between one point of the crucible and the rest.
At very beginning, when the source silicon was getting molten, the electron beam was scanned. Once the evaporation started, we did not scan anymore. I will try with this option. Thanks Juan José De Miguel sir
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