I want to do EBSD analysis on the resistance spot welded sample of DP1000 steel. However, at the final polishing stage, using colloidal silica, the surface become completely chemically etched by the polishing solution(after 3-5 min polishing). Besides, I have gap in my sample and mounting powders come out from the gap and stick to the surface of material. I do not know how I can remove these particles.
Steel is not steel and colloidal silica not colloidal silica. In principle the way you have selected is correct. You only need to optimize the procedure and I guess e can only give you some advice even if they finally won't work. We usually use different colloidal silica since they have different ph-values. You can even invert the topography if you find the correct candidates. We do this for nickel-based superalloys.
In order to change the etching behavior you can buffer the silica by NH3 or H2O2. Also there you need a bit experience how many drops at 100ml you will need.
A total different alternative is ion etching or electrolytic etchin but I guess you would do this already if you would have this equipment.
Possible is also to perform a color etching. In a next step you remove the formed oxide layer using alumina or colloid silica again. This is sometimes easier to remove.
Thank you very much for your answer
Do you think that ion etching or electrolytic etching are better than mechanical polishing? As far as I know the roughness of ion etching is not better than mechanical polishing.If no, I can try it
I guess you will always generate a topography. The question is only how much can you accept? Electrolytic is in fact the best since you don't "touch" your surface. Unfortunately it is also "explosive" so that in Germany it is forbidden. Nevertheless, as long as I used it it resulted in nice surfaces. Also there the trick is to find good parameters. As far as I remember, the faster the better. If you have the opportunity, please check it and give a feedback here. Thanks!
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