Please I need to know the pressure ?, relative proportions of Titanium and Nitrogen Imput in the plasma chamber?, Discharge curent density directed to samples? , sample voltage?, target voltage in magnetron sputtering, emission curent when assisting plasma with tungsten filament? rf or DC ? . substrates are s. steel, and tool steel.
Unfortunately, all process parameters depend highly on your specific chamber setup and to my extent of knowledge there is no general ruly how to recalculate it. You will find papers with all kinds of parameters that have produced good TiN; the only chance you have is if the authors used a commercial sputtering tool and you happen to own the same model, then it should be roughly transferable.
Thank you J.Wreippert,
My chamber is a home made one. I wanted only a rough idea ,for example N2 should it be be 50% in Argon or a lot less ?
Best regards
Dear Azzeddine, you may know that for the deposition of TiN, you can use either TiN target in Ar atmosphere or Ti target in Ar+N2 atmosphere. Typically, using a TiN target is easier to get high quality TiN. Using Ti targets, you'd better keep the Ar/N2 flow rate above 1 to generate stable plasma during deposition. For instance, in one of our cases, we use 150 sccm Ar and 100 sccm N2. Article Scalable all-ceramic nanofilms as highly efficient and therm...
Besides, before deposition, the chamber should be evacuated down to a high vacuum (~10−6 Torr). You can also change the substrate temperature to control the composition of TiNx. For the substrate, you can use steel, Si wafer, copper, etc., but should be clean enough.- Badges
- Science topic
- Similar topics
- Physical Sciences
- Materials Science
- Materials
- Inorganic Materials
- Metals
- Alloys
- Steel