Dear Fellows,
We have the following problem:
After removal the oxid layer with wet polishing on a pure copper part, the composition of the new oxid layer seems to be different than before. A higher percentage of oxygen was measured with EDS.
- Could it be, that the chemical composition of the new oxid film is different (more CuO, less Cu2O)?
- Is it possible, that the newly grown oxid layer is thicker than the original one?
https://doi.org/10.1063/1.5028407
https://doi.org/10.1063/1.4919323
Dear Tamás Tóth
It is depend on:
1. How long and at what conditions copper part was stored before polishing.
2. How did you store copper part after polishing? Was it drying on air in ambient conditions?
The papers recommended by Doufnoune RACHIDA Rachida will be helpful for you. But, from my point of view, in the case of drying of copper in ambient conditions the formation of mix of copper (I or II) oxides and hydroxides takes place.
At the same time, reaction 2Cu(0) + H2O + CO2 + O2 = CuCO3*Cu(OH)2 can not be discounted.
With kind regards,
Liliya
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