I would like to have a comparison of the two structures. Is one better than the other and if so, why?
Currently this the best architecture and manufacturing technology for CPU/GPU.
The switch to FinFET was due to multiple reasons - but the major one is channel control.
Below 32/28 nm DIBL and other device parameters are such that you can no longer control your transistor. So if you wish to continue to scale down - FinFETs, Nanowires or any other form of 3D channel is a must.
The cost is another issue. FinFETs are costlier than planar devices - but it can range from a few percent up to 45%. 3D stacking is working quite well in NVM but for logic, it is much complex and has not been commercialized yet.
Bottom line - for logic (CPU/GPU/FPGA) FinFET is the only way to go below 28 nm node. In memory (flash particularly) the manufactures can stay on planar devices and make 3D stacking.
FinFET transistors - are the latest mass-produced, Si-based transistors - used in every major ULSI products.
- FinFETs were invented in order to overcome various performance issues on Planar transistors. See the charts below:
- FinFETs have significantly better performance - Vt, Speed, and leakage - due to a major geometrical change in the channel design. See the illustration below:
- FinFETs are harder to manufacture and have more complex challenges (design, reliability, etc.) vs. the previous planar devices.
- FinFETs are the current manufacturing platform for all major semiconductor companies. It is expected that future devices will be based on the FinFET platform.
Hi Sajal,
thanks a lot for your answer. My question was a bit different: what are the advantages of saddle finfet vs finfet?
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