Unfortunately the alumina that forms on the surface of 6061 is very stable and tenacious. Addition of Ti or TiB2 is the best bet but if it is pure bonding between the particles and matrix that you care about, then not to fret. The difference in the coefficients of thermal expansion between the two (B4C and Al6061) is very large and a good bond is obtained on cooling. We have seen this in a number of studies we have done on B4C/6061 composites. The only challenge is to make sure that the B4C particles are well dispersed into the Al6061 matrix.