I am looking for a substrate layer(/adhesive inhibitor) to which a sputtered deposited thin gold layer will have the lowers possible adhesion. General knowledge is that oxides (e.g. SiO2, Al2O3, TiO2) show bad adhesion. Thus I was wondering which one is the worst (best for me).
Also, the material should withstand 400°C and should be deposited as a thin (
Tomas Lednicky
Yes, you are right; later on, I would like to peel it off with some polymer (e.g. PDMS, parylene). Many papers are using similar techniques on Si/SiO2 wafers. Thus, I wondered whether SiO2 is best for that (or just most accessible) or if I can use something better since my substrate is aluminium, not SiO2.
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